AAEON BOXER-6641-PRO Fanless Embedded Box PC
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NG # 003608-HW-AAEON-O08
Manufactured by:
BOXER-6641-PRO Fanless Embedded Box PC with Socket Type 8th/9th Generation Intel® Processor
Specification
SYSTEM CPU Intel® i7-9700TE
Intel® i7-8700T
Intel® i5-8500T
Intel® i3-8100T
Pentium® G5400T
Celeron® G4900TChipset Intel® C246/H310 System Memory DDR4-2666 SO-DIMM slot x 2,
Up to 64GB, ECC or Non-ECC SupportDisplay Interface HDMI x 2 Storage Device 2.5” SATA HDD/SSD Bay x 2 Ethernet Intel® i211 x 3, i219 x 1 I/O HDMI x 2
RJ-45 x 4 for GbE LAN (i211 x 3, i219 x 1)
USB 3.2 Gen 1 x 4, USB2.0 x 4 (A1 model)
USB 3.2 Gen 1 x 8 (A2 model)
DB-9 x 6 for RS-232/422/485
10 pin Terminal Block for 8-bit DIO
Audio x 1 (MIC-in, Line-out)
3 pin 10~35V Power Input x 1
Power Button x 1
Remote Power switch x 1
Reset Button x 1Expansion Full-size Mini PCIe x 1
Full-size Mini Card x 1 (PCIe/mSATA switch by BIOS, Default: mSATA)
SIM slot x 1Indicator HDD LED x 1
SYS LED x 1OS support Windows® 10 64-bit
Linux Ubuntu 20.04.2POWER SUPPLY Power Requirement 3-pin DC Input 10~35V MECHANICAL Mounting Wall mount kit Dimensions (W x H x D) 10.4” x 3.19” x 6.15” (264.2mm x 80.92mm x 156.2mm) Gross Weight 10.4 lb (4.7 kg) Net Weight 8.2 lb (3.7 kg) ENVIRONMENTAL Operating Temperature -40°F ~ 158°F (-40°C ~ 70°C), according to IEC68-2-14 with 0.5 m/s AirFlow (w/Industrial wide Temp. SSD/RAM) Storage Temperature -40°C ~ 80°C Storage Humidity 5 ~ 95% @ 40C, non-condensing Anti-Vibration 2 Grms/ 5 ~ 500Hz/ operation (with SSD) Certification CE/FCC class A
Description
BOXER-6641-Pro, a recent addition to our Rugged Embedded BOX PC series, is powered by 9th/8th Generation Intel® Core™ processors (formerly Coffee Lake/Coffee Lake Refresh) to deliver the optimal performance for critical industrial applications. To meet the endurance required by deployments in harsh environments, BOX-6641-Pro supports extended operating temperature from -40°F ~ 158°F (-40°C ~ 70°C). In addition, with graphene adopted in thermal design, the fanless BOX-6641-Pro features far enhanced thermal efficiency to further improve computing performance in real-world applications.